Wire Bonder, Clean Room
Position: Wire Bonder, clean room

Description: Wire bonding small wire to silicon dies,
chips, thick film substrates and lead frames.

Skill Requirements: Familiarity with microscopes and
working with extremely small electronic die and chips.
Ability to read instruction manuals and drawings.

Physical Requirements: Good eyesight and hand
coordination.

Experience Requirements: Preference to experienced
operators with at least one year of continuous wire
bonding work.

On the Job Training: Available